coreless substrate
由JWang著作·2010·被引用13次—Inthispaper,thecorelesssubstratehasbeenproposedforthisstudyandhasbeenuseforflipchipBGAtoimprovetheelectricalperformance.Corelessflip ...,ETShasacorelessstructure,whichallowsfortheimplementationofmicrocircuitswithoutthe...
Plastic BGA Thin Substrate (Coreless Substrate)
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Features·Ultimatesubstratethicknessreductionispossible·Superiorelectricalcharacteristics·AvailableforbothWB(WireBonding)andFC(Flip-Chip) ...
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